Abstract:
Transceivers implemented with a combination of super-heterodyne and zero intermediate frequency (ZIF) topologies are disclosed. In an exemplary design, an apparatus includes a frequency conversion circuit and a local oscillator (LO) generator. The LO generator generates a first LO signal and a second LO signal. The frequency conversion circuit performs frequency conversion (i) between intermediate frequency (IF) and baseband, based on the first LO signal, for an IF signal and (ii) between radio frequency (RF) and baseband, based on the second LO signal, for an RF signal. The frequency conversion circuit may perform frequency downconversion (i) from IF to baseband for a super-heterodyne receiver and (ii) from RF to baseband for a ZIF receiver. Alternatively or additionally, the frequency conversion circuit may perform frequency upconversion (i) from baseband to IF for a super-heterodyne transmitter and (ii) from baseband to RF for a ZIF transmitter.
Abstract:
Transceivers implemented with a combination of super-heterodyne and zero intermediate frequency (ZIF) topologies are disclosed. In an exemplary design, an apparatus includes a frequency conversion circuit and a local oscillator (LO) generator. The LO generator generates a first LO signal and a second LO signal. The frequency conversion circuit performs frequency conversion (i) between intermediate frequency (IF) and baseband, based on the first LO signal, for an IF signal and (ii) between radio frequency (RF) and baseband, based on the second LO signal, for an RF signal. The frequency conversion circuit may perform frequency downconversion (i) from IF to baseband for a super-heterodyne receiver and (ii) from RF to baseband for a ZIF receiver. Alternatively or additionally, the frequency conversion circuit may perform frequency upconversion (i) from baseband to IF for a super-heterodyne transmitter and (ii) from baseband to RF for a ZIF transmitter.
Abstract:
Methods, systems, and devices are described for transceiver architecture for millimeter wave wireless communications. A device may include two transceiver chip modules configured to communicate in different frequency ranges. The first transceiver chip module may include a baseband sub-module, a first radio frequency front end (RFFE) component and associated antenna array. The second transceiver chip module may include a second RFFE component and associated antenna array. The second transceiver chip module may be separate from the first transceiver chip module. The second transceiver chip module may be electrically coupled to the baseband sub-module of the first transceiver chip module.