公开(公告)号：US20250016546A1

公开(公告)日：2025-01-09

申请号：US18347083

申请日：2023-07-05

Applicant: QUALCOMM Incorporated

Inventor： Sai Krishna CHITTOOR ,  Vijayakumar REDDY

IPC: H04W8/20

Abstract: Certain aspects of the present disclosure generally relate to electronic devices and, more particularly, to techniques and apparatus for temporarily transferring subscriber identity module (SIM) profiles. One example method generally includes: receiving, from a first user equipment (UE), a request to obtain a SIM profile associated with a second UE, the first UE being different than the second UE; transmitting a first message including the SIM profile associated with the second UE in response to the request; and communicating with the first UE using the SIM profile.