公开(公告)号：US20220123470A1

公开(公告)日：2022-04-21

申请号：US17075098

申请日：2020-10-20

Applicant: QUALCOMM Incorporated

Inventor： Jeongil Jay KIM ,  Sangkil KIM ,  Darryl Sheldon JESSIE

IPC: H01Q5/40 ,  H01Q9/04 ,  H01Q9/06

Abstract: Various wireless device and antenna array configurations are provided. An example wireless device includes at least one radio frequency integrated circuit, at least one patch antenna element operably coupled to the at least one radio frequency integrated circuit, at least one dipole antenna comprising two dipole antenna elements disposed adjacent to the at least one patch antenna element and operably coupled to the at least one radio frequency integrated circuit, and at least one high impedance surface disposed below the at least one dipole antenna and adjacent to the at least one patch antenna element.