公开(公告)号：US10749468B1

公开(公告)日：2020-08-18

申请号：US16418709

申请日：2019-05-21

Applicant: QUALCOMM Incorporated

Inventor： Ji-Hoon Park ,  Yido Koo ,  Jeongsik Yang ,  Wei-Han Cho ,  Xiaoyu Wang

IPC: H03B5/12 ,  H03L7/099 ,  H03L7/093 ,  H01L27/02

Abstract: Certain aspects relate to a semiconductor die. The semiconductor die includes a voltage-controlled oscillator (VCO), wherein the VCO includes a resonant capacitor, and a resonant inductor coupled in parallel with the resonant capacitor. The resonant inductor includes a first elongated portion and a second elongated portion that are parallel with each other. The semiconductor die also includes a voltage supply line configured to route a supply voltage to the VCO, wherein the voltage supply line includes a first portion that runs parallel with the first and second elongated portions of the resonant inductor and is located between the first and second elongated portions of the resonant inductor.