公开(公告)号：US20170210062A1

公开(公告)日：2017-07-27

申请号：US15094202

申请日：2016-04-08

Applicant: Quanta Computer Inc.

Inventor： Ching-Chih CHEN ,  Lin-Huei WANG ,  Lai-Peng LAI ,  Ying-Cheng CHEN

IPC: B29C65/56

CPC classification number: B29C65/56 ,  B29C63/0052 ,  B29C63/0073 ,  B29C63/02 ,  B29C63/024 ,  B29K2709/08 ,  B29K2995/0026 ,  B29L2031/3475

Abstract: A method of bonding substrates includes steps as follows. Providing a curved glass substrate and a flexible light-transmissive film; moving a roller to press the flexible light-transmissive film onto the curved glass substrate so that the flexible light-transmissive film matches a curvature of the curved glass substrate to gradually fit and bond onto the curved glass substrate; sensing the attaching level of at least one local area of the flexible light-transmissive film bonded on the curved glass substrate; and adjusting a press force exerted by the roller to the local area of the flexible light-transmissive film according to the attaching level during the flexible light-transmissive film is bonded onto the curved glass substrate.