公开(公告)号：US12011734B2

公开(公告)日：2024-06-18

申请号：US17021199

申请日：2020-09-15

Applicant: RAYTHEON TECHNOLOGIES CORPORATION

Inventor： Andrew W. Justice ,  Nicholas A. Bunce ,  Baris A. Sen

IPC: B05B7/10 ,  F23D11/38

CPC classification number: B05B7/10 ,  F23D11/383 ,  F23D2900/14241

Abstract: A guide plate for a swirler assembly is disclosed. In various embodiments, the guide plate includes a guide plate flange configured for engagement with a swirler body having a plurality of primary swirler inlets; and a first plurality of purge holes extending through the guide plate flange and configured to introduce a first vectored purge flow into the swirler body.

公开(公告)号：US20220082258A1

公开(公告)日：2022-03-17

申请号：US17021199

申请日：2020-09-15

Applicant: RAYTHEON TECHNOLOGIES CORPORATION

Inventor： Andrew W. Justice ,  Nicholas A. Bunce ,  Baris A. Sen

IPC: F23R3/14 ,  F23D11/38 ,  F23R3/28

Abstract: A guide plate for a swirler assembly is disclosed. In various embodiments, the guide plate includes a guide plate flange configured for engagement with a swirler body having a plurality of primary swirler inlets; and a first plurality of purge holes extending through the guide plate flange and configured to introduce a first vectored purge flow into the swirler body.