公开(公告)号：US20180012776A1

公开(公告)日：2018-01-11

申请号：US15203732

申请日：2016-07-06

申请人： RJR Technologies, Inc.

发明人： Richard J. Ross ,  John Ni ,  Raymond J. Bregante ,  Biao Fu ,  Michael Bregante ,  Cresencio Amparo

IPC分类号： H01L21/52

CPC分类号： H01L21/52 ,  H01L21/50 ,  H01L21/67126

摘要： The present disclosure describes a sealing processes and structure for sealing air cavity electronic packages using a thermosetting, thermal plastic, other known or as yet unknown adhesives, or hybrid combinations of such adhesive(s). Processes disclosed comprise steps of providing a base and a lid, with at least one of the base and the lid having a mating surface coated with the adhesive. Initially, an air gap is maintained between the base, the lid, and the adhesive and a vacuum is generated around the base, the lid, and the adhesive. Once the vacuum has been generated, the base and the lid are mated to create a mated package assembly with a vacuum therein. After the mating, the mated package assembly is heated to a curing temperature to cure the adhesive, and pressure may be applied as well. Because the air within the mated package assembly has been evacuated prior to heating, there is no air pressure build-up therein, reducing or eliminating the presence of blowouts and pin holes.

公开(公告)号：US10115605B2

公开(公告)日：2018-10-30

申请号：US15203732

申请日：2016-07-06

申请人： RJR Technologies, Inc.

发明人： Richard J. Ross ,  John Ni ,  Raymond J. Bregante ,  Biao Fu ,  Michael Bregante ,  Cresencio Amparo

IPC分类号： H01L21/52 ,  H01L21/50

摘要： The present disclosure describes a sealing processes and structure for sealing air cavity electronic packages using a thermosetting, thermal plastic, other known or as yet unknown adhesives, or hybrid combinations of such adhesive(s). Processes disclosed comprise steps of providing a base and a lid, with at least one of the base and the lid having a mating surface coated with the adhesive. Initially, an air gap is maintained between the base, the lid, and the adhesive and a vacuum is generated around the base, the lid, and the adhesive. Once the vacuum has been generated, the base and the lid are mated to create a mated package assembly with a vacuum therein. After the mating, the mated package assembly is heated to a curing temperature to cure the adhesive, and pressure may be applied as well. Because the air within the mated package assembly has been evacuated prior to heating, there is no air pressure build-up therein, reducing or eliminating the presence of blowouts and pin holes.