公开(公告)号：US11637377B2

公开(公告)日：2023-04-25

申请号：US17299513

申请日：2019-11-22

Applicant: ROGERS CORPORATION

Inventor： Gianni Taraschi ,  Kristi Pance ,  Stephen O'Connor ,  Christopher Brown ,  Trevor Polidore ,  Allen F. Horn, III ,  Dirk Baars ,  Roshin Rose George ,  Jared Duperre ,  Shailesh Pandey ,  Karl E. Sprentall ,  Shawn P. Williams ,  William Blasius

IPC: H01Q9/04 ,  H01Q21/00 ,  H01Q21/06 ,  H01P7/10 ,  H01P1/208

Abstract: A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.

公开(公告)号：US20220029297A1

公开(公告)日：2022-01-27

申请号：US17299513

申请日：2019-11-22

Applicant: ROGERS CORPORATION

Inventor： Gianni Taraschi ,  Kristi Pance ,  Stephen O'Connor ,  Christopher Brown ,  Trevor Polidore ,  Allen F. Horn, III ,  Dirk Baars ,  Roshin Rose George ,  Jared Duperre ,  Shailesh Pandey ,  Karl E. Sprentall ,  Shawn P. Williams ,  William Blasius

IPC: H01Q9/04 ,  H01Q21/00 ,  H01Q21/06

Abstract: A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.