公开(公告)号：US20240120261A1

公开(公告)日：2024-04-11

申请号：US18528149

申请日：2023-12-04

Applicant: ROHM CO., LTD.

Inventor： Daichi NIWA ,  Yuki SETA ,  Koshun SAITO

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L23/3107

Abstract: A semiconductor device capable of suppressing separation of a sealing resin at an internal reverse surface is provided. The semiconductor device includes a semiconductor element, a first lead on which the semiconductor element is mounted, and a sealing resin covering the semiconductor element and a part of the lead. The lead includes an obverse surface to which the semiconductor element is bonded, a reverse surface facing away from the obverse surface in a thickness direction of the first lead and exposed from the sealing resin, and an internal reverse surface facing the same side as a side that the reverse surface faces in the thickness direction and covered with the sealing resin. The internal reverse surface includes an irregular portion.