公开(公告)号：US20230140231A1

公开(公告)日：2023-05-04

申请号：US17915274

申请日：2021-03-26

Applicant: ROHM CO., LTD.

Inventor： Satoshi KIMOTO

IPC: B41J2/335 ,  B41J2/34

Abstract: A thermal print head includes a substrate, a resistor layer and a wiring layer. The substrate is made of a single crystal semiconductor and includes an obverse surface facing in one sense of a thickness direction. The resistive layer is supported by the substrate and includes a plurality of heat generating parts arranged side by side in a main scanning direction. The wiring layer is supported by the substrate and forms a conductive path to the plurality of heat generating parts. The wiring layer includes a conductive part and a heat generating sub-part for each of the plurality of heat generating parts, where the conductive part has a lower resistance value per unit length in a sub-scanning direction than the heat generating part, and where the heat generating sub-part has a resistance value per unit length in the sub-scanning direction that falls between the respective resistance values of the heat generating part and the conductive part. The substrate includes a ridge raised from the obverse surface and extending in the main scanning direction. The heat generating part, the heat generating sub-part and the conductive part are disposed on the ridge. The heat generating sub-part is located between the heat generating part and the conductive part in the sub-scanning direction.

公开(公告)号：US20170054071A1

公开(公告)日：2017-02-23

申请号：US15233657

申请日：2016-08-10

Applicant: ROHM CO., LTD.

Inventor： Hirofumi TAKEDA ,  Satoshi KIMOTO

IPC: H01L43/06 ,  H01L43/14 ,  H01L21/768 ,  H01L29/04

Abstract: A semiconductor device includes a semiconductor element, a semiconductor substrate on which the semiconductor element is mounted, a conductive layer formed on the substrate, and a sealing resin covering the semiconductor element. The substrate is formed with a recess receding from a main surface of the substrate and including a bottom surface and first and second sloped surfaces spaced apart from each other in a first direction perpendicular to the thickness direction of the substrate. The conductive layer includes first conduction paths on the first sloped surface, second conduction paths on the second sloped surface and bottom conduction paths on the bottom surface. The second sloped surface includes exposed regions line-symmetrical to the first conduction paths with respect to a line perpendicular to both the thickness direction of the substrate and the first direction, and the second conduction paths are not disposed at the exposed regions.

Abstract translation: 半导体器件包括半导体元件，其上安装有半导体元件的半导体衬底，形成在衬底上的导电层和覆盖半导体元件的密封树脂。 衬底形成有从衬底的主表面退出的凹部，并且包括底面和在垂直于衬底的厚度方向的第一方向上彼此间隔开的第一和第二倾斜表面。 导电层包括第一倾斜表面上的第一导电路径，第二倾斜表面上的第二导电路径和底表面上的底部传导路径。 第二倾斜表面包括相对于垂直于基板的厚度方向和第一方向的线与第一导电路径线对称的暴露区域，并且第二导电路径不设置在暴露区域。

公开(公告)号：US20240375411A1

公开(公告)日：2024-11-14

申请号：US18654422

申请日：2024-05-03

Applicant: ROHM CO., LTD.

Inventor： Satoshi KIMOTO

IPC: B41J2/335

Abstract: A thermal print head includes: a substrate including a main surface; an insulating film arranged on the main surface; a first wiring layer arranged on the insulating film; a first interlayer insulating film arranged on the first wiring layer; a heat-generating body film; and a second wiring layer arranged on the first interlayer insulating film with the heat-generating body film interposed therebetween, wherein a bump is formed on the main surface, wherein the bump extends along a first direction in a plan view, wherein the second wiring layer extends along a second direction orthogonal to the first direction to intersect the bump in a plan view, and includes first, second, third, and fourth wirings arranged along the first direction, wherein the second wiring is located between the first wiring and the third wiring, and wherein the third wiring is located between the second wiring and the fourth wiring.