THERMAL PRINT HEAD
    1.
    发明公开
    THERMAL PRINT HEAD 审中-公开

    公开(公告)号:US20240286416A1

    公开(公告)日:2024-08-29

    申请号:US18444063

    申请日:2024-02-16

    申请人: ROHM CO., LTD.

    IPC分类号: B41J2/335

    摘要: The present disclosure provides a thermal print head. The thermal print head includes: a substrate; a glaze layer, disposed on the substrate; and a wiring layer, disposed on the glaze layer. The wiring layer includes a plurality of bonding pads. The plurality of bonding pads are divided into a plurality of groups. Each of the plurality of groups includes a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad. A first group of the plurality of groups is adjacent to a second group of the plurality of groups along a first direction. The second bonding pad of the first group is located between a center of the first bonding pad of the first group and a center of the third bonding pad of the first group along the first direction.