公开(公告)号：US11905601B2

公开(公告)日：2024-02-20

申请号：US16793675

申请日：2020-02-18

Applicant: RTX CORPORATION

Inventor： Michael L. Hribernik ,  Fred K. Haake

IPC: G01L1/04 ,  G01L1/06 ,  G01L1/24 ,  C23C4/08 ,  C23C28/00 ,  C23C4/10 ,  G01L5/00 ,  G01N3/00 ,  G01N25/00 ,  C23C8/00

CPC classification number: C23C4/08 ,  C23C4/10 ,  C23C8/00 ,  C23C28/321 ,  C23C28/322 ,  C23C28/345 ,  C23C28/3455 ,  G01L5/0047 ,  G01N3/00 ,  G01N25/005 ,  Y10T428/2495 ,  Y10T428/24975

Abstract: A thermal barrier coating is provided. The thermal barrier coating is configured to remain adherent to a substrate under high strains, thus allowing the use of non-contacting strain measurement systems, using digital image correlation for example. The thermal barrier coating may include a first layer of a partially metallic material configured to adhere to a metallic substrate, and a second layer of a partially ceramic material configured to adhere to the first layer. A successful configuration has a top layer thickness that is approximately two-thirds of the first layer thickness.