公开(公告)号：US20090151267A1

公开(公告)日：2009-06-18

申请号：US12316169

申请日：2008-12-10

申请人： Rachana D. Upadhyay ,  Srinivasan Ramanath ,  Robert F. Corcoran, JR. ,  Thomas Puthanangady ,  Richard W. J. Hall ,  Lynn L. Harley

发明人： Rachana D. Upadhyay ,  Srinivasan Ramanath ,  Robert F. Corcoran, JR. ,  Thomas Puthanangady ,  Richard W. J. Hall ,  Lynn L. Harley

IPC分类号： B24D3/00 ,  B24D3/10 ,  B24D3/30

CPC分类号： B24D3/02 ,  B23D61/028 ,  B24D5/12 ,  B24D18/0009

摘要： Abrasive tools and techniques are disclosed that can cut hard, brittle materials to relatively precise dimensions. The tools, which can include a hybrid bond of metal or metal alloy and a resin matrix together with fine abrasive grits, can be employed, for example, in mirror finish cutting applications, thereby enabling ‘1×’ or ‘single-pass’ multi-function abrasive processes. The specific selection of resin and metal or metal alloy types is such that the tool is sufficiently brittle for the purpose of manufacture and durability, but ductile enough to withstand the grinding and handling stresses (an exemplary hybrid bond includes bronze and polyimide). Numerous tool types and applications will be apparent in light of this disclosure, including abrasive products for electronic device manufacturing such as thin 1A8 blades (single blade or multi-blade configuration).

摘要翻译： 公开了研磨工具和技术，其可以将硬的脆性材料切割成相对精确的尺寸。 可以使用可以包括金属或金属合金的混合结合的工具以及树脂基质和精细的磨料砂粒，例如在镜面切割应用中，从而使得“1x”或“单程” 功能研磨工艺。 树脂和金属或金属合金类型的具体选择使得该工具为了制造和耐久性而足够脆，但是足够坚固以承受研磨和处理应力（示例性的混合键包括青铜和聚酰亚胺）。 根据本公开内容，许多工具类型和应用将是显而易见的，包括用于电子设备制造的磨料产品，例如薄1A8刀片（单刀片或多刀片配置）。