MULTILAYER CMP PADS
    1.
    发明申请

    公开(公告)号:US20250073842A1

    公开(公告)日:2025-03-06

    申请号:US18710642

    申请日:2023-09-03

    Abstract: A polishing pad comprising a textile layer, a compressible layer, and a water impermeable layer disposed between the textile layer and the compressible layer. The polishing pad reduces slurry use by improving slurry transport and requires no diamond conditioning to maintain slurry transport.

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