公开(公告)号：US06415397B1

公开(公告)日：2002-07-02

申请号：US09660714

申请日：2000-09-13

申请人： Ramon S. Co ,  Steve Si-Yu Chen ,  Fred Yen Kong ,  Thang Nguyen

发明人： Ramon S. Co ,  Steve Si-Yu Chen ,  Fred Yen Kong ,  Thang Nguyen

IPC分类号： H02H305

CPC分类号： G01R31/01 ,  G01R31/31713 ,  G01R31/31905 ,  G11C5/04 ,  G11C29/028 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5004 ,  H05K1/141

摘要： A test station for testing memory modules uses multiple personal computer (PC) motherboards for performing functional tests on the modules. The motherboards are mounted upside-down with the solder-side up at the desktop level of the test station frame. One or more of the memory-module sockets on each motherboard is removed. A test adaptor board is plugged into the holes of the removed socket, but mounted on the reverse, solder side of the motherboard rather than the component side. The test adaptor board has a test socket that receives a module being tested. An overhead robotic arm picks up memory modules from an input tray and inserts them into test sockets for testing by the motherboards. Since the cables, components, and expansion boards of the motherboards are hidden below the solder-side surface of the motherboards, while the test adaptor board is above, the overhead robotic arm can easily navigate to the test socket without obstruction. Modules that pass are inspected in transit when the robotic arm holds the module in front of a camera that sends images to an image inspection processor.

摘要翻译： 用于测试内存模块的测试站使用多台个人计算机（PC）主板对模块进行功能测试。 主板安装在测试台框架的桌面级上方，上面是焊接面朝上。 每个主板上的一个或多个内存模块插槽都被删除。 测试适配器板插入已卸下的插座的孔中，但安装在主板的反面焊接面，而不是组件侧。 测试适配器板有一个测试插座，可以接收正在测试的模块。 顶置机器人手臂从进纸盒中取出内存模块，将其插入测试插座，以便主板进行测试。 由于主板的电缆，组件和扩展板被隐藏在主板的焊接侧表面之下，而测试适配器板位于上方，则架空机器人手臂可以轻松地导航到测试插座而无障碍。 当机器手臂将模块保持在将图像发送到图像检查处理器的相机前面时，通过的模块被检查。

公开(公告)号：US06357023B1

公开(公告)日：2002-03-12

申请号：US09702017

申请日：2000-10-30

申请人： Ramon S. Co ,  Steve Si-Yu Chen ,  Fred Yen Kong ,  Thang Nguyen

发明人： Ramon S. Co ,  Steve Si-Yu Chen ,  Fred Yen Kong ,  Thang Nguyen

IPC分类号： H02H305

CPC分类号： G01R31/01 ,  G01R31/31713 ,  G01R31/31905 ,  G11C5/04 ,  G11C29/028 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5004 ,  H05K1/141

摘要： Memory modules are tested using a test assembly with a personal computer (PC) motherboard. The motherboard is mounted upside-down with its solder-side up to a metal plate using standoffs. A memory-module socket on the motherboard is removed. An opening is made in the metal plate above the removed socket. A well is attached to the metal plate at the opening. The well supports a test adaptor board below the metal plate so that the test adaptor board has a closer spacing to the motherboard than does the metal plate. The test adaptor board has a test socket that receives a module being tested. Pins from the test adaptor board are plugged into the holes of the removed socket on the motherboard, but mounted on the reverse, solder side of the motherboard rather than the component side. The cables, components, and expansion boards of the motherboards are hidden below the metal plate and motherboard, and can be cooled without cooling the memory module in the test socket. A top plate or air guide can be added above the metal plate to blow hot air on the memory module being tested in the test socket, while the cooling air is blown on the motherboard.

摘要翻译： 使用具有个人计算机（PC）主板的测试组件测试内存模块。 主板使用对接方式将其焊接侧倒置到金属板上。 主板上的内存模块插槽被拆除。 在拆卸的插座上方的金属板上形成一个开口。 一个井在开口处附着在金属板上。 该井在金属板下面支撑测试适配器板，使得测试适配器板与母板相比，具有比金属板更近的间隔。 测试适配器板有一个测试插座，可以接收正在测试的模块。 来自测试适配器板的引脚插入主板上拆卸的插槽的孔中，但安装在母板的反面焊接面，而不是组件侧。 主板的电缆，组件和扩展板隐藏在金属板和主板下面，可以在不对测试插座内的内存模块进行冷却的情况下进行冷却。 可以在金属板上方添加顶板或空气引导件，以将吹入测试插座中的被测试的存储器模块上的热空气吹到主板上。