公开(公告)号：US07112885B2

公开(公告)日：2006-09-26

申请号：US10888350

申请日：2004-07-07

申请人： Ray T. Chen ,  Chulchae Chol

发明人： Ray T. Chen ,  Chulchae Chol

IPC分类号： H01L23/24 ,  H01S3/04

CPC分类号： H05K1/0274 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0203

摘要： The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

摘要翻译： 本发明提供了一种用于改进布置在印刷电路板（104）内的电 - 光发射机（100）的系统，方法和装置。 散热器（110,200）是设置在印刷电路板（104）的空腔（102）内并且热耦合到电 - 光发射器（100）的底表面（112）的导热材料， 。 导热材料的一部分大致延伸到印刷电路板（104）的层（114,116或118）的外表面（120,122或124）。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外，本发明提供一种制造散热器的方法，其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。

公开(公告)号：US07457491B2

公开(公告)日：2008-11-25

申请号：US11524576

申请日：2006-09-21

申请人： Ray T. Chen ,  Chulchae Chol

发明人： Ray T. Chen ,  Chulchae Chol

IPC分类号： G02B6/30 ,  G02B6/42

CPC分类号： H05K1/0274 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0203

摘要： The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.