公开(公告)号：US11075141B2

公开(公告)日：2021-07-27

申请号：US16569330

申请日：2019-09-12

Applicant: Raytheon Company

Inventor： Anurag Gupta ,  David A. Brooks ,  Mary K. Herndon

IPC: H01L23/42 ,  H01L21/48 ,  H01L23/46 ,  H01L23/367

Abstract: An apparatus includes a module base configured to carry one or more devices to be cooled. The module base includes a cover and a heat sink connected to the cover. The cover includes first and second encapsulation layers and a thermal spreader between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings. The module base includes multiple tabs inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.

公开(公告)号：US20160205806A1

公开(公告)日：2016-07-14

申请号：US14995051

申请日：2016-01-13

Applicant: Raytheon Company

Inventor： David A. Brooks ,  Joseph R. Ellsworth ,  Costas Karageorgis ,  Corey R. DeLisle ,  Joseph M. Crowder

IPC: H05K7/20 ,  F28F1/40 ,  F28F1/04

CPC classification number: H05K7/20163 ,  F28F1/04 ,  F28F1/40 ,  F28F19/02 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An air-cooled heat exchanger includes a housing having an intake for air flowing through the housing and at least one outlet for the air flowing through the housing. A set of segmented fins extend within the housing between the intake and the at least one outlet, configured to direct the air flowing through the housing. Each segment of the segmented fins has a length selected based on a throw distance for an environmental protection coating process employed to apply an environmental protection coating to surfaces of the fin segments. Access ports extend through at least one wall of the housing at locations allowing connection, when the access ports are unblocked, of electrical conductors used in the environmental protection coating process to both ends of each of the fin segments. Access port covers block each of the access ports during operation of the air-cooled heat exchanger.

Abstract translation: 一种风冷式热交换器包括壳体，该外壳具有用于空气流过壳体的进气口和用于空气流过壳体的至少一个出口。 一组分段翅片在壳体内延伸在进气口和至少一个出口之间，构造成引导流过壳体的空气。 分段翅片的每个段具有基于用于将环境保护涂层施加到鳍片段的表面的环境保护涂覆工艺的投掷距离而选择的长度。 进入端口延伸穿过壳体的至少一个壁，当允许接入端口被阻挡时，允许在环境保护涂覆过程中使用的电导体中的每个鳍​​片段的两端的连接。 在风冷式热交换器的操作过程中，进出口盖住每个进出口。

公开(公告)号：US09999155B2

公开(公告)日：2018-06-12

申请号：US14995051

申请日：2016-01-13

Applicant: Raytheon Company

Inventor： David A. Brooks ,  Joseph R. Ellsworth ,  Costas Karageorgis ,  Corey R. DeLisle ,  Joseph M. Crowder

IPC: F28F7/00 ,  H05K7/20 ,  F28F1/04 ,  F28F1/40 ,  F28F19/02 ,  H01L23/467

CPC classification number: H05K7/20163 ,  F28F1/04 ,  F28F1/40 ,  F28F19/02 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An air-cooled heat exchanger includes a housing having an intake for air flowing through the housing and at least one outlet for the air flowing through the housing. A set of segmented fins extend within the housing between the intake and the at least one outlet, configured to direct the air flowing through the housing. Each segment of the segmented fins has a length selected based on a throw distance for an environmental protection coating process employed to apply an environmental protection coating to surfaces of the fin segments. Access ports extend through at least one wall of the housing at locations allowing connection, when the access ports are unblocked, of electrical conductors used in the environmental protection coating process to both ends of each of the fin segments. Access port covers block each of the access ports during operation of the air-cooled heat exchanger.

公开(公告)号：US20200091035A1

公开(公告)日：2020-03-19

申请号：US16569330

申请日：2019-09-12

Applicant: Raytheon Company

Inventor： Anurag Gupta ,  David A. Brooks ,  Mary K. Herndon

IPC: H01L23/42 ,  H01L23/367 ,  H01L23/46 ,  H01L21/48

Abstract: An apparatus includes a module base configured to carry one or more devices to be cooled. The module base includes a cover and a heat sink connected to the cover. The cover includes first and second encapsulation layers and a thermal spreader between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings. The module base includes multiple tabs inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.