公开(公告)号：US20240341063A1

公开(公告)日：2024-10-10

申请号：US18298185

申请日：2023-04-10

Applicant: Raytheon Company

Inventor： James D. Saraidaridis ,  Malcolm P. MacDonald ,  Robert M. Darling ,  Craig H. McCordic ,  James S. Wilson

IPC: H05K7/20 ,  F28F7/02

CPC classification number: H05K7/20327 ,  F28F7/02 ,  H05K7/20336 ,  F42B15/34

Abstract: A cold plate is disclosed for cooling electronics within a missile. The cold plate includes a housing enclosing a compartment. An outlet manifold is inside the compartment. A wick is inside the compartment and is adjacent to the outlet manifold. A liquid inlet is fluidically connected to the wick. A vapor outlet fluidically connects the outlet manifold to atmosphere or space.