公开(公告)号：US12236571B2

公开(公告)日：2025-02-25

申请号：US17933014

申请日：2022-09-16

Applicant: Raytheon Company

Inventor： Adam R. Girard ,  Gabriel A. Payan ,  Charlie Y. Chen ,  Christopher J. Cormier ,  Mark D. Sprinkel

IPC: H04N5/33 ,  F17C13/06 ,  G06T7/00

Abstract: An apparatus includes a Dewar having an endcap. The apparatus also includes a heat sink and a thermal interface material configured to thermally couple the endcap of the Dewar to the heat sink. The thermal interface material includes an amorphous pliable material that is configured to transfer thermal energy between the endcap of the Dewar and the heat sink without structurally coupling the Dewar to the heat sink. A thermal shoe may be positioned between the thermal interface material and the heat sink, and the thermal shoe may be configured to hold the thermal interface material against the endcap. The thermal shoe may have (i) a smaller cross-sectional size in a portion of the thermal shoe contacting the thermal interface material and (ii) a larger cross-sectional size in a portion of the thermal shoe contacting the heat sink.