公开(公告)号：US20220254750A1

公开(公告)日：2022-08-11

申请号：US17169098

申请日：2021-02-05

Applicant: Raytheon Company

Inventor： Patrick E. Boyle ,  James E. Benedict ,  Erika Klek ,  Mikhail Pevzner

IPC: H01L23/00

Abstract: Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.

公开(公告)号：US12266629B2

公开(公告)日：2025-04-01

申请号：US17169098

申请日：2021-02-05

Applicant: Raytheon Company

Inventor： Patrick E. Boyle ,  James E. Benedict ,  Erika Klek ,  Mikhail Pevzner

IPC: H01L23/00

Abstract: Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.