公开(公告)号：US20220117110A1

公开(公告)日：2022-04-14

申请号：US17066391

申请日：2020-10-08

Applicant: Raytheon Company

Inventor： Richard P. Dube ,  Mark S. Langelier ,  Paul A. Sefcsik, JR. ,  Jason P. Rosa ,  Curtis B. Carlsten ,  Michael F. Janik ,  Mark R. Franklin, JR.

IPC: H05K7/20

Abstract: A system includes a first slice and a second slice coupled to each other. Each slice includes a housing formed of an electrically-insulative material, a ceramic plate disposed at each end of the housing, and an end plate disposed over each of the ceramic plates. Each end plate is formed of a thermally-conductive material. The system also includes a backplane assembly coupled to the first slice and the second slice.