公开(公告)号：US20240217455A1

公开(公告)日：2024-07-04

申请号：US18555178

申请日：2021-04-16

Applicant: Resonac Corporation

Inventor： Satoshi TAKAYASU ,  Mari SHIMIZU ,  Tomohiko KOTAKE

IPC: B60R13/08

CPC classification number: B60R13/08

Abstract: Provided is a sound absorbing material, including: a protective layer; a first substrate layer having a communication hole; and a second substrate layer having a communication hole, in this order, in which a flexibility-toughness value of the protective layer, which is represented by Formula (I) described below, is 1 to 75 [MPa/μm].








Flexibility
-
Toughness
⁢

Value

=


(

Tensile
⁢


Modulus

[
MPa
]

⁢

of
⁢

Protective
⁢

Layer
⁢

at
⁢

25
⁢
°C
×
Shore
⁢

A
⁢

Hardness
⁢

of
⁢

Protective
⁢

Layer

)

/
Protective
⁢

Layer
⁢


Thickness

[
μm
]






(
I
)