公开(公告)号：US20100302734A1

公开(公告)日：2010-12-02

申请号：US12474333

申请日：2009-05-29

申请人： Richard Alfred Beaupre ,  Ljubisa Dragoljub Stevanovic ,  Dieter Gerhard Brunner

发明人： Richard Alfred Beaupre ,  Ljubisa Dragoljub Stevanovic ,  Dieter Gerhard Brunner

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L23/3731 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heatsink assembly for cooling a heated device includes a ceramic substrate having a plurality of cooling fluid channels integrated therein. The ceramic substrate includes a topside surface and a bottomside surface. A layer of electrically conducting material is bonded or brazed to only one of the topside and bottomside surfaces of the ceramic substrate. The electrically conducting material and the ceramic substrate have substantially identical coefficients of thermal expansion.

摘要翻译： 用于冷却加热设备的散热器组件包括具有集成在其中的多个冷却流体通道的陶瓷基板。 陶瓷基板包括顶侧表面和底部表面。 一层导电材料被结合或钎焊到仅陶瓷衬底的顶侧和底部表面中的一个。 导电材料和陶瓷基片具有基本相同的热膨胀系数。