摘要:
A system comprises a controller device, an integrated circuit buffer device and a first and second memory device. A first plurality of signal lines is coupled to the controller device. A second plurality of signal lines is coupled to the first memory device and the integrated circuit buffer device. The second plurality of signal lines carries first address information from the integrated circuit buffer device to the first memory device. A third plurality of signal lines is coupled to the first memory device and the integrated circuit buffer device. The third plurality of signal lines carries first control information from the integrated circuit buffer device to the first memory device. A first signal line is coupled to the first memory device and the integrated circuit buffer device. The first signal line carries a first signal from the integrated circuit buffer device to the first memory device. The first signal synchronizes communication of the first control information from the integrated circuit buffer device to the first memory device.
摘要:
An integrated circuit buffer device comprising a receiver circuit to receive control information and address information. A first interface portion provides at least a first control signal that specifies a write operation to a first memory device. The first control signal corresponds to the control information. A second interface portion provides a first address to the first memory device. The first address corresponds to the address information. The first address specifies a memory location for the write operation to the first memory device. A third interface portion provides a first signal to the first memory device. The first signal synchronizes communication of the first control signal from the integrated circuit buffer device to the first memory device. A fourth interface portion provides at least a second control signal that specifies a write operation to a second memory device. The second control signal corresponds to the control information. A fifth interface portion provides a second address to the second memory device. The second address corresponds to the address information. The second address specifies a memory location for the write operation to the second memory device. A sixth interface portion provides a second signal to the second memory device. The second signal synchronizes communication of the second control signal from the integrated circuit buffer device to the second memory device.
摘要:
A memory module includes an integrated circuit buffer device that receives control information via a connector interface. A first plurality of signal lines carries a first address from the integrated circuit buffer device to a first memory device. A second plurality of signal lines carries a first control signal from the integrated circuit buffer device to the first memory device. The first control signal specifies a read operation by the first memory device such that the first memory device provides first data, accessed from a memory location in the first memory device based on the first address, to the integrated circuit buffer device. A first signal line carries a first signal from the integrated circuit buffer device to the first memory device. The first signal synchronizes communication of the first control signal from the integrated circuit buffer device to the first memory device. A third plurality of signal lines carries a second address from the integrated circuit device to the second memory device. A fourth plurality of signal lines carries a second control signal from the integrated circuit buffer device to the second memory device. The second control signal specifies a read operation. The second control signal corresponds to the control information. A second signal line carries a second signal from the integrated circuit buffer device to the second memory device. The second signal synchronizes communication of the second control signal from the integrated circuit buffer device to the second memory device. A transmitter circuit is disposed on the integrated circuit buffer device.
摘要:
A memory system architecture/interconnect topology that includes at least one point-to-point link between a master, and at least one memory subsystem. The memory subsystem includes a buffer device coupled to a plurality of memory devices. The memory system may be upgraded through dedicated point-to-point links and corresponding memory subsystems. The master communicates to the plurality of memory devices in each memory subsystem through the respective buffer device via each point-to-point link.
摘要:
A memory system architecture/interconnect topology that includes at least one point-to-point link between a master, and at least one memory subsystem. The memory subsystem includes a buffer device coupled to a plurality of memory devices. The memory system may be upgraded through dedicated point-to-point links and corresponding memory subsystems. The master communicates to the plurality of memory devices in each memory subsystem through the respective buffer device via each point-to-point link
摘要:
A system comprises a controller device, an integrated circuit buffer device and a first and second memory device. A first plurality of signal lines is coupled to the controller device. A second plurality of signal lines is coupled to the first memory device and the integrated circuit buffer device. The second plurality of signal lines carries first address information from the integrated circuit buffer device to the first memory device. A third plurality of signal lines is coupled to the first memory device and the integrated circuit buffer device. The third plurality of signal lines carries first control information from the integrated circuit buffer device to the first memory device. A first signal line is coupled to the first memory device and the integrated circuit buffer device. The first signal line carries a first signal from the integrated circuit buffer device to the first memory device. The first signal synchronizes communication of the first control information from the integrated circuit buffer device to the first memory device.
摘要:
A system comprises a master device and a first integrated circuit buffer device. A first plurality of integrated circuit memory devices are coupled to the first integrated circuit buffer device. A first plurality of signal lines are coupled to the first integrated circuit buffer device and the master device, wherein the first plurality of signal lines communicate control information, address information and data from the master device to the first integrated circuit buffer device. A second plurality of signal lines are coupled to the first integrated circuit buffer device. A second integrated circuit buffer device is coupled to the second plurality of signal lines, the second integrated circuit buffer device receives the control information, the address information and the data from the first integrated circuit buffer device over the second plurality of signal lines. A second plurality of integrated circuit memory devices are coupled to the second integrated circuit buffer device. A third plurality of signal lines are coupled to the first integrated circuit buffer device, the second integrated circuit buffer device and the master device. The third plurality of signal lines communicate information from the master device that initialize the first integrated circuit buffer device and the second integrated circuit buffer device.
摘要:
A memory system architecture/interconnect topology that includes at least one point-to-point link between a master, and at least one memory subsystem. The memory subsystem includes a buffer device coupled to a plurality of memory devices. The memory system may be upgraded through dedicated point-to-point links and corresponding memory subsystems. The master communicates to the plurality of memory devices in each memory subsystem through the respective buffer device via each point-to-point link.
摘要:
A memory system architecture/interconnect topology that includes at least one point-to-point link between a master, and at least one memory subsystem. The memory subsystem includes a buffer device coupled to a plurality of memory devices. The memory system may be upgraded through dedicated point-to-point links and corresponding memory subsystems. The master communicates to the plurality of memory devices in each memory subsystem through the respective buffer device via each point-to-point link.
摘要:
A system comprises a controller device, an integrated circuit buffer device and a first and second memory device. A first plurality of signal lines is coupled to the controller device. A second plurality of signal lines is coupled to the first memory device and the integrated circuit buffer device. The second plurality of signal lines carries first address information from the integrated circuit buffer device to the first memory device. A third plurality of signal lines is coupled to the first memory device and the integrated circuit buffer device. The third plurality of signal lines carries first control information from the integrated circuit buffer device to the first memory device. A first signal line is coupled to the first memory device and the integrated circuit buffer device. The first signal line carries a first signal from the integrated circuit buffer device to the first memory device. The first signal synchronizes communication of the first control information from the integrated circuit buffer device to the first memory device.