公开(公告)号：US07169288B2

公开(公告)日：2007-01-30

申请号：US10980035

申请日：2004-11-03

申请人： Richard J. Drapeau

发明人： Richard J. Drapeau

IPC分类号： C23F13/02

CPC分类号： H04Q1/02 ,  C23F13/04 ,  C23F13/06 ,  H04Q1/03 ,  H04Q1/15 ,  H04Q2201/10 ,  H04Q2201/14

摘要： Systems and methods of cathodic protection. The system includes a metallic housing, a backplane situated within the metallic housing, a cathodic protection card coupled to the backplane and a permanent anode, external to the metallic housing, coupled to the cathodic protection card through an isolated port. The cathodic protection system is powered using span power. The permanent anode and metallic housing are adapted to form a closed circuit when both come in contact with an electrolyte. The permanent anode is maintained at a higher potential than the metallic housing.

摘要翻译： 阴极保护的系统和方法。 该系统包括金属壳体，位于金属壳体内的背板，耦合到背板的阴极保护卡和金属外壳外部的永久阳极，其通过隔离端口耦合到阴极保护卡。 阴极保护系统采用跨度电源供电。 永久阳极和金属壳体适于当两者都与电解质接触时形成闭合回路。 永久阳极保持在比金属外壳更高的电位。

公开(公告)号：US07272002B2

公开(公告)日：2007-09-18

申请号：US11280366

申请日：2005-11-16

申请人： Richard J. Drapeau

发明人： Richard J. Drapeau

IPC分类号： G06F1/16

CPC分类号： G06F1/20

摘要： Methods and systems for auxiliary cooling of electrical device housings are provided. In one embodiment, an electronics device enclosure system is provided. The system comprises a housing, wherein the housing encloses one or more electronic devices; a backplane situated within the housing wherein at least one of the one or more electronic devices are coupled to the backplane; and an auxiliary cooling system coupled to the backplane and adapted to receive electrical power from one or more power sources, wherein the auxiliary cooling system comprises one or both of a thermoelectric cooling module and a fan, and wherein the auxiliary cooling system is adapted to increase the heat transfer from the one or more electronic devices to an environment external to the housing.

摘要翻译： 提供了用于电气设备外壳辅助冷却的方法和系统。 在一个实施例中，提供电子设备外壳系统。 该系统包括壳体，其中壳体包围一个或多个电子设备; 位于所述壳体内的背板，其中所述一个或多个电子设备中的至少一个耦合到所述背板; 以及耦合到所述背板并适于从一个或多个电源接收电力的辅助冷却系统，其中所述辅助冷却系统包括热电冷却模块和风扇中的一个或两个，并且其中所述辅助冷却系统适于增加 从一个或多个电子设备到壳体外部的环境的热传递。