公开(公告)号：US20240297101A1

公开(公告)日：2024-09-05

申请号：US18308665

申请日：2023-04-27

Applicant: Richtek Technology Corporation

Inventor： Yu-Lin Yang ,  Ming-Chih Hsu ,  Chun-Hao Chang

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49534 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541

Abstract: A packaging method, includes: providing a continuous multi-package structure, which includes a lead frame and a molding layer formed on the lead frame, wherein the lead frame includes a plurality of recesses formed on a bottom surface on a side of the lead frame opposite to the molding layer; forming a coating layer on the bottom surface, to cover the bottom surface and the recesses on the bottom surface; and mechanically cutting the continuous multi-package structure through the recesses, to separately form a plurality of packaging units, wherein in each of the packaging units, an exposed portion of the lead frame exposed in the recesses includes a step shape.