Abstract:
A silicon controlled rectifier includes: a substrate; a N well and a P well positioned on a side of the substrate and contact with each other; a first N region and a first P region positioned on an upper surface of the N well and contact with each other; a second N region and a second P region positioned on an upper surface of the P well and contact with each other; a first oxide isolation region isolating the first P region and the second N region; a second oxide isolation region isolating the second N region and the second P region; an anode terminal coupled with the first N region and the first P region; and a cathode terminal coupled with the second N region and the second P region. The first P region has a doping concentration less than 80% of that of the second P region.