公开(公告)号：US4473455A

公开(公告)日：1984-09-25

申请号：US473261

申请日：1983-03-14

申请人： Robert E. Dean ,  James L. Fink

发明人： Robert E. Dean ,  James L. Fink

IPC分类号： C23C14/50 ,  H01L21/673 ,  C23C15/00

CPC分类号： H01L21/68728 ,  C23C14/50 ,  H01L21/68764 ,  H01L21/68771 ,  Y10S156/917 ,  Y10S269/903

摘要： At least three spring-mounted members disposed around the periphery of an aperture in a wafer-mounting plate are arranged to engage and securely hold edge portions of a semiconductor wafer to be processed. When the spring-mounted members are actuated toward the front side of the plate, a wafer can be freely moved into or out of the aperture from the back side of the plate by means of a vacuum chuck that contacts only the back side of the wafer. After a wafer to be held is inserted within the aperture, the actuated members are released. The released members move toward the back side of the plate and thereby engage the edges of the inserted wafer and exert radial holding forces thereon. The back side of a wafer so mounted is adapted to be brought into resilient engagement with a pedestal element in a processing chamber, thereby ensuring good thermal and electrical contact between the wafer and the pedestal element.

摘要翻译： 设置在晶片安装板的孔周围的至少三个弹簧安装构件被布置成接合并牢固地保持待加工的半导体晶片的边缘部分。 当弹簧安装构件朝向板的前侧致动时，通过仅接触晶片背面的真空卡盘，可以使晶片从板的背面自由地移入或移出孔 。 将要保持的晶片插入孔内之后，致动构件被释放。 释放的构件朝向板的背面移动，从而接合插入的晶片的边缘并在其上施加径向保持力。 如此安装的晶片的背面适于与处理室中的基座元件弹性接合，从而确保晶片和基座元件之间良好的热和电接触。