公开(公告)号：US08525600B1

公开(公告)日：2013-09-03

申请号：US13281369

申请日：2011-10-25

申请人： Robert S. Vendryes ,  Ericka Sleight ,  Donald L. Davis ,  Jerome Chang ,  Jack L. Mix ,  Ronald Dammann

发明人： Robert S. Vendryes ,  Ericka Sleight ,  Donald L. Davis ,  Jerome Chang ,  Jack L. Mix ,  Ronald Dammann

IPC分类号： H03B5/32 ,  H01L41/053

CPC分类号： H03H9/08 ,  H03H9/1007

摘要： A protective assembly that is adapted to provide temperature isolation for an electronic device is disclosed. The assembly includes a housing having a cavity with a top surface and at least one side surface. The housing is configured to accept an electronic device having a top and a bottom in the cavity with the top of the electronic device proximate to the top surface of the cavity. The housing is further configured to maintain a vacuum within the cavity. The assembly includes at least one support disposed within the cavity. The at least one support is configured to contact the housing only at a first point proximate to the top surface of the cavity and contact the electronic device only at a second point that is proximate to the bottom of the electronic device.

摘要翻译： 公开了一种适用于为电子设备提供温度隔离的保护组件。 组件包括具有顶部表面和至少一个侧表面的空腔的壳体。 壳体被配置为接收具有顶部和底部的电子设备，电子设备的顶部靠近空腔的顶表面。 壳体还被构造成在空腔内保持真空。 所述组件包括设置在所述空腔内的至少一个支撑件。 所述至少一个支撑件构造成仅在靠近腔的顶表面的第一点处接触壳体，并且仅在靠近电子设备底部的第二点接触电子设备。