Fast surface interpolation
    1.
    发明申请
    Fast surface interpolation 审中-公开
    快速表面插补

    公开(公告)号:US20060284870A1

    公开(公告)日:2006-12-21

    申请号:US10556287

    申请日:2004-05-06

    IPC分类号: G06T15/40

    CPC分类号: G06T17/30

    摘要: The invention relates to an imaging device DEV comprising means for interpolating SIP a surface D from a set S of paths. Said imaging device DEV includes determination means UIF for determining at least two closed termination curves C1 and C2, said termination curves C1 and C2 joining points of the set S of paths, namely one point for each path of the set S of paths, in such a way that the set S of paths constitutes a junction between the two termination curves C1 and C2. Said surface interpolation for interpolating a surface D is constrained according to the invention by said set S of paths and said termination curves C1 and C2. The invention enables very fast interpolation of a surface while providing an analytical expression of this surface.

    摘要翻译: 本发明涉及一种成像装置DEV,其包括用于从一组路径内插SIP表面D的装置。 所述成像装置DEV包括用于确定至少两个闭合终止曲线C 1和C 2的确定装置UIF,连接路径组S的点的所述终止曲线C 1和C 2,即组S的每个路径的一个点 路径,使得路径集合S构成两个终止曲线C 1和C 2之间的连接点。 用于内插表面D的所述表面插值根据本发明由所述路径组S和所述终止曲线C 1和C 2约束。 本发明能够非常快速地插入表面,同时提供该表面的分析表达。