公开(公告)号：US20170222521A1

公开(公告)日：2017-08-03

申请号：US15009980

申请日：2016-01-29

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Edwin Xikai Sun ,  Wei Zhu ,  Shun Feng ,  Mark R. Cooper ,  Paul J. Grosskreuz ,  Robert H. Schmidt

IPC: H02K9/22 ,  H02K11/25 ,  H02K11/21

CPC classification number: H02K9/22 ,  H02K11/21

Abstract: A system and method for cooling an enclosed position feedback device mounted to a motor is disclosed. An active cooling device is mounted between the position feedback device and the housing enclosing the position feedback device. A compliant mount is provided to accommodate vibration in the position feedback device. The compliant mount may be a compliant thermal pad positioned between the feedback device and the active cooling device. Optionally, the compliant mount may be provided between the motor and the position feedback device.

公开(公告)号：US10263497B2

公开(公告)日：2019-04-16

申请号：US15009980

申请日：2016-01-29

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Edwin Xikai Sun ,  Wei Zhu ,  Shun Feng ,  Mark R. Cooper ,  Paul J. Grosskreuz ,  Robert H. Schmidt

IPC: H02K9/22 ,  H02K11/00 ,  H02K11/21

Abstract: A system and method for cooling an enclosed position feedback device mounted to a motor is disclosed. An active cooling device is mounted between the position feedback device and the housing enclosing the position feedback device. A compliant mount is provided to accommodate vibration in the position feedback device. The compliant mount may be a compliant thermal pad positioned between the feedback device and the active cooling device. Optionally, the compliant mount may be provided between the motor and the position feedback device.