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    Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
    1.
    发明申请
    Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness 有权
    双面基板集成电路封装，包括具有增加厚度的引线的引线框架

    公开(公告)号：US20050179123A1

    公开(公告)日：2005-08-18

    申请号：US10780163

    申请日：2004-02-17

    申请人： Roger Mock ,  Erich Gerbsch

    发明人： Roger Mock ,  Erich Gerbsch

    IPC分类号： H01L21/44 ,  H01L23/495 ,  H01L23/498

    CPC分类号： H01L23/49833 ,  H01L23/49861 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49222 ,  H01L2924/00

    摘要： An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

    摘要翻译： 集成电路封装包括具有第一内表面的第一非导电衬底和具有第二内表面的第二非导电衬底。 具有第一厚度的模具设置在第一和第二内表面之间。 引线框架包括具有近端和远端的构件。 近端具有小于第一厚度的第二厚度。 远端设置在第一和第二内表面之间。 远端是起伏的，使得远端具有大于第二厚度的有效厚度。

    Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
    2.
    发明申请
    Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness 审中-公开
    双面基板集成电路封装，包括具有增加厚度的引线的引线框架

    公开(公告)号：US20070069348A1

    公开(公告)日：2007-03-29

    申请号：US11543605

    申请日：2006-10-05

    申请人： Roger Mock ,  Erich Gerbsch

    发明人： Roger Mock ,  Erich Gerbsch

    IPC分类号： H01L23/495 ,  H01L21/00

    CPC分类号： H01L23/49833 ,  H01L23/49861 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49222 ,  H01L2924/00

    摘要： An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

    摘要翻译： 集成电路封装包括具有第一内表面的第一非导电衬底和具有第二内表面的第二非导电衬底。 具有第一厚度的模具设置在第一和第二内表面之间。 引线框架包括具有近端和远端的构件。 近端具有小于第一厚度的第二厚度。 远端设置在第一和第二内表面之间。 远端是起伏的，使得远端具有大于第二厚度的有效厚度。