公开(公告)号：US11242609B2

公开(公告)日：2022-02-08

申请号：US16653216

申请日：2019-10-15

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Jamie Y. C. Chen ,  Michael Lipschutz ,  Miguel A. Rodriguez ,  Kin Cheung Lo

IPC: C25D3/64

Abstract: Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.

公开(公告)号：US20210108324A1

公开(公告)日：2021-04-15

申请号：US16653216

申请日：2019-10-15

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Jamie Y.C. Chen ,  Michael Lipschutz ,  Miguel A. Rodriguez ,  Kin Cheung Lo

IPC: C25D3/64

Abstract: Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.