Electronic microelement assembly
    1.
    发明授权
    Electronic microelement assembly 失效
    电子微型组件

    公开(公告)号:US3701075A

    公开(公告)日:1972-10-24

    申请号:US3701075D

    申请日:1970-09-22

    Applicant: SAAB SCANIA AB

    CPC classification number: H05K7/10

    Abstract: An electronic circuit microelement, seated on the upper surface of a supporting member, has its terminals projecting upwardly away from said surface to a level well above its body. Elongated connectors, one for each terminal, have medial parts anchored in the supporting member, pin-like lower parts projecting beneath the lower surface of the supporting member, and upper parts formed as upstanding S-shaped spring arms that engage the microelement terminals in a plane spaced above the microelement body so that the connectors can be soldered to the terminals by immersion.

    Abstract translation: 坐在支撑构件的上表面上的电子电路微元件具有其端部从所述表面向上突出到远远高于其本体的水平面。 细长的连接器,每个端子一个,具有锚定在支撑构件中的中间部分,在支撑构件的下表面下方突出的销状下部,以及形成为直立的S形弹簧臂的上部,所述上部形成为与微型元件端子接合的直立的S形弹簧臂 平面在微元件主体上方间隔开,使得连接器可以通过浸入被焊接到端子上。

Patent Agency Ranking