公开(公告)号：US20180312650A1

公开(公告)日：2018-11-01

申请号：US15770986

申请日：2016-10-17

Applicant: SABIC Global Technologies B.V.

Inventor： Yaqin ZHANG ,  Ming GU ,  Feng JIANG ,  Mingcheng GUO

IPC: C08J7/04 ,  C09D5/24 ,  C09D5/32

CPC classification number: C08J7/04 ,  C08J2375/04 ,  C09D5/24 ,  C09D5/32

Abstract: An article may comprise a substrate formed from a thermoplastic or thermoset; and a thermal conductive or heat absorptive coating disposed adjacent the substrate to form a composite stack, wherein the composite stack is characterized by an increase of through plane thermal conductivity of at least 2 W/m*K, when compared to the substrate without the coating.