公开(公告)号：US20190217427A1

公开(公告)日：2019-07-18

申请号：US16248505

申请日：2019-01-15

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Kyongho HONG ,  Jinwon BAEK ,  Jeongho YI ,  Jinpyung LEE

IPC: B23K37/04 ,  B23K26/38 ,  B25B11/00

CPC classification number: B23K37/0408 ,  B23K26/38 ,  B23K2101/40 ,  B25B11/005

Abstract: A stage for cutting a substrate includes: a body member; a plurality of first discharging members, each including a first suction portion in the body member and a first partition wall portion connected to the first suction portion and protruding from a top surface of the body member, each of the first discharging members defining a first space connected to an outside; a plurality of second discharging members, each including a second suction portion in the body member and a second partition wall portion connected to the second suction portion and protruding from the top surface of the body member, each of the second discharging members defining a second space connected to the outside; a plurality of connecting pipes each connected to the first partition wall portion and the second partition wall portion; and a plurality of supply pipes connected to the connecting pipes.