公开(公告)号：US20140320853A1

公开(公告)日：2014-10-30

申请号：US14040626

申请日：2013-09-28

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Ki-Young Yeon ,  Na-Ri Ahn ,  Kang-Hyun Kim ,  Jung-Hwa Park

IPC: G01N21/88

CPC classification number: G01N21/88 ,  G01N21/8422 ,  G01N2021/8438

Abstract: A method of measuring damage of an organic layer of a thin film encapsulation includes: preparing a thin film encapsulation structure in which an inorganic layer is stacked on an organic layer, in which a light-emitting material is mixed; irradiating light to the thin film encapsulation structure so that light is emitted from the light-emitting material, the intensity of light emitted from the light emitting material decreasing over time; detecting a light emission lifetime of the light emitted from the light emitting material; and determining a degree of damage to the organic layer based on the light emission lifetime. Accordingly, a degree of the damage to the organic layer due to plasma may be easily detected, and the damage to the organic layer may be minimized based on the detected degree of the damage by improving plasma process conditions for an operation of forming an inorganic layer.

Abstract translation: 测量薄膜封装的有机层的损伤的方法包括：制备其中混合有发光材料的有机层上的无机层堆叠的薄膜封装结构; 向所述薄膜封装结构照射光，使得从所述发光材料发射光，从所述发光材料发射的光的强度随时间而减小; 检测从发光材料发射的光的发光寿命; 并根据发光寿命确定有机层的损伤程度。 因此，可以容易地检测到由等离子体引起的对有机层的损伤程度，并且通过改善形成无机层的操作的等离子体处理条件，可以基于检测到的损伤程度来最小化对有机层的损伤 。

公开(公告)号：US09091661B2

公开(公告)日：2015-07-28

申请号：US14040626

申请日：2013-09-28

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Ki-Young Yeon ,  Na-Ri Ahn ,  Kang-Hyun Kim ,  Jung-Hwa Park

IPC: G01N21/88 ,  G01N21/84

CPC classification number: G01N21/88 ,  G01N21/8422 ,  G01N2021/8438

Abstract: A method of measuring damage of an organic layer of a thin film encapsulation includes: preparing a thin film encapsulation structure in which an inorganic layer is stacked on an organic layer, in which a light-emitting material is mixed; irradiating light to the thin film encapsulation structure so that light is emitted from the light-emitting material, the intensity of light emitted from the light emitting material decreasing over time; detecting a light emission lifetime of the light emitted from the light emitting material; and determining a degree of damage to the organic layer based on the light emission lifetime. Accordingly, a degree of the damage to the organic layer due to plasma may be easily detected, and the damage to the organic layer may be minimized based on the detected degree of the damage by improving plasma process conditions for an operation of forming an inorganic layer.

Abstract translation: 测量薄膜封装的有机层的损伤的方法包括：制备其中混合有发光材料的有机层上的无机层堆叠的薄膜封装结构; 向所述薄膜封装结构照射光，使得从所述发光材料发射光，从所述发光材料发射的光的强度随时间而减小; 检测从发光材料发射的光的发光寿命; 并根据发光寿命确定有机层的损伤程度。 因此，可以容易地检测到由等离子体引起的对有机层的损伤程度，并且通过改善形成无机层的操作的等离子体处理条件，可以基于检测到的损伤程度来最小化对有机层的损伤 。