公开(公告)号：US20250087092A1

公开(公告)日：2025-03-13

申请号：US18528138

申请日：2023-12-04

Applicant: SAMSUNG E&A CO., LTD. ,  Morai Inc.

Inventor： Jun Chul HWANG ,  Sung Il KIM ,  Yong Ho AHN ,  Jae Hun CHOI ,  Taek Sun LEE ,  Hwang JEON ,  Jun HONG ,  Ji Won JUNG

IPC: G08G1/16 ,  G06T17/20 ,  G08G1/01

Abstract: Disclosed are a three-dimensional (3D) simulation method and a 3D simulation apparatus. The 3D simulation method disclosed herein includes a step (S20) of separating point cloud data including a road, an obstacle, and a cargo transportation route into road data and obstacle data, a step (S40) of converting the road data into road mesh data, and converting the obstacle data into obstacle mesh data, a step (S60) of constructing a virtual environment by merging the road mesh data with the obstacle mesh data, a step (S80) of loading a specific cargo transportation route to the virtual environment, a step (S100) of loading a 3D transport truck and a 3D cargo to a predetermined point of the cargo transportation route, and a step (S120) of performing a route survey simulation while virtually driving the 3D transport truck and the 3D cargo along the cargo transportation route.