公开(公告)号：US20200022258A1

公开(公告)日：2020-01-16

申请号：US16390310

申请日：2019-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung-Jun LIM ,  Seong-Hwan PARK ,  Kyung-Ho LEE ,  Kyung-Moon JUNG ,  Chul-Kyu KIM

IPC: H05K1/02

Abstract: A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.