公开(公告)号：US20200321293A1

公开(公告)日：2020-10-08

申请号：US16430959

申请日：2019-06-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Doo IL KIM ,  Won Wook SO ,  Young Sik HUR ,  Jung Chul GONG

IPC: H01L23/66 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01Q1/52 ,  H01Q1/38

Abstract: An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.