公开(公告)号：US20200176386A1

公开(公告)日：2020-06-04

申请号：US16537923

申请日：2019-08-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho-Hyung HAM ,  Sa-Yong LEE ,  Ju-Ho KIM

IPC: H01L23/538 ,  H01L23/00 ,  H01L21/48

Abstract: Provided is a printed circuit board including a laminate that is formed by vertically stacking a plurality of insulating layers including a rigid insulating layer, a flexible insulating layer having a first region in vertical contact with at least one of the plurality of insulating layers and a second region located on an outer side of the laminate, and a first electronic element embedded in the flexible insulating layer.