公开(公告)号：US20230386736A1

公开(公告)日：2023-11-30

申请号：US18110013

申请日：2023-02-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Boum Seock Kim ,  Byeong Cheol Moon ,  Sang Jin Kim ,  Han Lee ,  Hyo Yong Sim

IPC: H01F27/32 ,  H01F27/30 ,  H01F27/29 ,  H01F27/02

CPC classification number: H01F27/323 ,  H01F27/306 ,  H01F27/292 ,  H01F27/022

Abstract: A coil component includes a body including a first surface and a second surface opposing each other in a first direction, a coil portion disposed in the body and including first and second coils, and a via connecting the first and second coils to each other, an insulating film covering the coil portion and extending to a region between the first and second coils, and first and second external electrodes disposed on the body and connected to the coil portion. The insulating film is in contact with at least one of opposing surfaces of the first and second coils which face each other and is in contact with a side surface of the via.