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公开(公告)号：US20240186055A1
公开(公告)日：2024-06-06
申请号：US18442523
申请日：2024-02-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yu Jong KIM , Jong Min LEE
CPC classification number: H01F27/2804 , H01F27/022 , H01F2027/2809
Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on the support substrate, an encapsulant encapsulating at least portions of the support substrate and the coil pattern, and external electrodes disposed externally on the encapsulant and connected to the coil pattern. The coil pattern includes a seed layer having a thickness of 1.5 μm or less and a plating layer disposed on the seed layer.
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公开(公告)号：US20200219644A1
公开(公告)日：2020-07-09
申请号：US16554285
申请日：2019-08-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Young KIM , Jong Min LEE
Abstract: A coil component includes a body; an insulating substrate embedded in the body; and a coil portion disposed on at least one surface of the insulating substrate. The insulating substrate is inclined with respect to one surface of the body, in a cross-section of the body in a width-thickness direction.
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公开(公告)号：US20200168386A1
公开(公告)日：2020-05-28
申请号：US16566282
申请日：2019-09-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Hyuk JUNG , Jong Min LEE
IPC: H01F27/28 , H01F27/29 , H01F27/32 , H01F41/04 , H01F27/255
Abstract: A coil electronic component includes a body, a coil portion disposed in the body and including a support substrate and a coil pattern disposed on at least one surface of the support substrate and forming at least one turn, and first and second external electrodes disposed on external surfaces of the body and connected to both ends of the coil pattern, respectively. The first and second external electrodes include a first plating layer disposed on an end surface of the body and a conductive resin layer covering the first plating layer and extending to a main surface of the body, to be connected to the coil pattern. An aspect ratio of the coil pattern is less than 1 and a width W1 of the coil pattern satisfies 0.8W2≤W1≤W2 as compared with a width W2 of the first and second external electrodes.
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Patent Agency Ranking
公开(公告)号：US20230023322A1
公开(公告)日：2023-01-26
申请号：US17952508
申请日：2022-09-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Seob LEE , Jong Min LEE
Abstract: A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3
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公开(公告)号：US20200321155A1
公开(公告)日：2020-10-08
申请号：US16666965
申请日：2019-10-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Il PARK , Jong Min LEE
IPC: H01F27/28 , H01F27/29 , H01F27/245 , H01F41/04 , H01F41/02
Abstract: A coil component includes a body having a first surface and a second surface facing each other, and having a plurality of wall surfaces connecting the first surface to the second surface; an insulating substrate; a coil portion comprising a first lead-out pattern and a second lead-out pattern each covered with the body and disposed on the insulating substrate; a first external electrode and a second external electrode disposed on the first surface of the body and spaced apart from each other; a first connection electrode and a second connection electrode respectively extending from the first and second lead-out patterns to the first and second external electrodes; and a first support portion and a second support portion respectively extending from the coil portion to be exposed to one of the plurality of wall surfaces, and respectively disposed to be spaced apart from the first and second lead-out patterns.
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公开(公告)号：US20200185142A1
公开(公告)日：2020-06-11
申请号：US16591283
申请日：2019-10-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yu Jong KIM , Jong Min LEE
Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on the support substrate, an encapsulant encapsulating at least portions of the support substrate and the coil pattern, and external electrodes disposed externally on the encapsulant and connected to the coil pattern. The coil pattern includes a seed layer having a thickness of 1.5 μm or less and a plating layer disposed on the seed layer.
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公开(公告)号：US20200168392A1
公开(公告)日：2020-05-28
申请号：US16597490
申请日：2019-10-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Ryung HU , Yu Jong KIM , Hye Yeon JEON , Young Do CHOI , Jong Min LEE , Seung Hee KIM
IPC: H01F27/29 , H01F17/00 , H01F27/255 , H01F27/28 , H01F41/04
Abstract: A coil electronic component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body in which the support substrate and the coil portion are embedded, and first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively. A thickness of the body is 0.55 mm or less. The body includes a cover portion disposed on the coil portion. A ratio of a thickness of the coil portion to a thickness of the cover portion is 5:5 to 8:2.
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公开(公告)号：US20200168387A1
公开(公告)日：2020-05-28
申请号：US16597737
申请日：2019-10-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Hee KIM , Jong Min LEE
IPC: H01F27/28 , H01F27/29 , H01F27/255 , H01F41/04
Abstract: An inductor includes a body, a coil pattern embedded in the body, a first external electrode and a second external electrode disposed on one surface of the body to be respectively connected to both ends of the coil pattern, and a support member disposed inside the body to support the coil pattern, wherein b/a≥1.5, in which “a” denotes a distance from a central surface between top and bottom surfaces of the support member to a top surface of the body, and “b” denotes a distance from the central surface of the support member to a bottom surface of the body.
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