公开(公告)号：US20240298409A1

公开(公告)日：2024-09-05

申请号：US18386963

申请日：2023-11-03

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Jong-Seok Na ,  Yunje Ji ,  Yonghoon Kim ,  Seungeun Lee

IPC分类号： H05K1/18 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K1/181 ,  H05K1/185 ,  H05K3/4007 ,  H05K3/4697 ,  H05K3/0017

摘要： The present disclosure provides a circuit board including: an insulating layer; a circuit wire disposed in a first area inside the insulating layer, a first conductive pad connected to the circuit wire and having an upper surface protruding above an upper surface of the insulating layer and a lower surface embedded in the insulating layer; and a circuit element disposed to have a boundary surface parallel to the upper surface of the insulating layer in a second area different from the first area inside the insulating layer and including an element pad.