公开(公告)号：US20200090871A1

公开(公告)日：2020-03-19

申请号：US16525732

申请日：2019-07-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Mo AHN ,  Sang Roc LEE ,  Dong Hwi SHIN

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H01G4/228

Abstract: A multilayer capacitor includes a body including a stack structure of a plurality of dielectric layers, and a plurality of internal electrodes stacked with the dielectric layers interposed therebetween. A stress alleviation portion is disposed on at least one surface among surfaces of the body, and an external electrode is disposed on an external portion of the body and connected to the internal electrodes. The stress alleviation portion includes a first resin layer adjacent to the body, and a second resin layer covering the first resin layer and including a filler dispersed in a resin of the second resin layer.