公开(公告)号：US20240363281A1

公开(公告)日：2024-10-31

申请号：US18404270

申请日：2024-01-04

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Byeongcheol Moon ,  Sangjin Kim ,  Han Lee ,  Boumseock Kim

IPC分类号： H01F27/28 ,  H01F27/29

CPC分类号： H01F27/2828 ,  H01F27/2804 ,  H01F27/29

摘要： A coil component according to an embodiment includes a body; a first coil embedded in the body and disposed to surround around a first core axis extending in a first direction, a second coil embedded in the body and disposed to surround around a second core axis parallel to the first core axis, and arranged in a second direction perpendicular to the first direction on the outside of the first coil; and a non-magnetic body disposed to surround the outer region of the first coil and the second coil.