公开(公告)号：US20230055918A1

公开(公告)日：2023-02-23

申请号：US17528575

申请日：2021-11-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chung Hyeon RYU ,  Hyo Kyong SEO ,  Jun Ho YUN ,  Ye Ji HWANG ,  Seung Been KIM

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G2/06

Abstract: A conductive paste includes a core including a first metal and a shell including a second metal having a melting point higher than that of the first metal and enclosing a surface of the core. A multilayer ceramic component includes an external electrode having a sintered electrode layer made of the conductive paste.