公开(公告)号：US10276467B2

公开(公告)日：2019-04-30

申请号：US15440181

申请日：2017-02-23

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Eun Sil Kim ,  Doo Hwan Lee ,  Dae Jung Byun ,  Tae Ho Ko ,  Yeong A Kim

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538

摘要： A fan-out semiconductor package includes: a fan-out semiconductor package may include: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a reinforcing layer disposed on the encapsulant. The first interconnection member and the second interconnection member respectively include redistribution layers electrically connected to the connection pads of the semiconductor chip.