公开(公告)号：US11227716B2

公开(公告)日：2022-01-18

申请号：US16031341

申请日：2018-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Min Hur ,  Bourn Seock Kim ,  Dong Ho Han

IPC: H01F27/30 ,  H01F5/00 ,  H01F27/32 ,  H01L23/522 ,  H01F5/06 ,  H01F27/02 ,  H01F17/04 ,  H01F27/29 ,  H01F17/00

Abstract: An inductor includes a support member; a coil including a plurality of coil patterns disposed on one surface or the other surface of the support member, an insulating layer surrounding the coil, and an encapsulant encapsulating the support member and the coil patterns. At least portions of the insulating layer may be disposed to be recessed from the one surface or the other surface of the support member toward a center of the support member.

公开(公告)号：US20230238168A1

公开(公告)日：2023-07-27

申请号：US18121653

申请日：2023-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Min Hur ,  Dong Ho Han ,  Boum Seock Kim

IPC: H01F27/28 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F41/041 ,  H01F2027/2809

Abstract: A coil component includes a support substrate, a coil portion including a first conductive layer being in contact with one surface of the support substrate, and a second conductive layer disposed on the first conductive layer to be spaced apart from the one surface of the support substrate, and a body including the support substrate and the coil portion embedded in the body. One side of the first conductive layer is closer to a center of the second conductive layer in a width direction of the coil portion than one side of the second conductive layer.

公开(公告)号：US11631522B2

公开(公告)日：2023-04-18

申请号：US16893826

申请日：2020-06-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Min Hur ,  Dong Ho Han ,  Boum Seock Kim

IPC: H01F27/28 ,  H01F41/04

Abstract: A coil component includes a support substrate, a coil portion including a first conductive layer being in contact with one surface of the support substrate, and a second conductive layer disposed on the first conductive layer to be spaced apart from the one surface of the support substrate, and a body including the support substrate and the coil portion embedded in the body. One side of the first conductive layer is closer to a center of the second conductive layer in a width direction of the coil portion than one side of the second conductive layer.

公开(公告)号：US11145452B2

公开(公告)日：2021-10-12

申请号：US15821003

申请日：2017-11-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Boum Seock Kim ,  Byeong Cheol Moon ,  Kang Wook Bong ,  Young Min Hur ,  Joung Gul Ryu

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/12 ,  H01F27/32 ,  H01F41/04 ,  H01F27/255 ,  H01F17/00

Abstract: An inductor includes a body including a support member, a coil, and an encapsulant, and external electrodes on external surfaces of the body. The coil in the body may be formed so that a plurality of coil patterns are continuously formed, wherein the coil pattern includes first and second coil layers, and the encapsulant extends downward between adjacent coil patterns to be between first coil layers of adjacent coil patterns.

公开(公告)号：US20210057142A1

公开(公告)日：2021-02-25

申请号：US16893826

申请日：2020-06-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Min Hur ,  Dong Ho Han ,  Boum Seock Kim

IPC: H01F27/28 ,  H01F41/04

Abstract: A coil component includes a support substrate, a coil portion including a first conductive layer being in contact with one surface of the support substrate, and a second conductive layer disposed on the first conductive layer to be spaced apart from the one surface of the support substrate, and a body including the support substrate and the coil portion embedded in the body. One side of the first conductive layer is closer to a center of the second conductive layer in a width direction of the coil portion than one side of the second conductive layer.