公开(公告)号：US20250132234A1

公开(公告)日：2025-04-24

申请号：US18652312

申请日：2024-05-01

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Yongjae KIM ,  Hyeonjae KIM ,  Sungwoo PARK ,  Junseop BYEON ,  Semin OH

IPC: H01L23/498 ,  H01L23/522 ,  H01L23/528

Abstract: Disclosed are interposers and semiconductor packages. The interposer includes a core layer, an upper wiring layer on the core layer, a plurality of lower pads on a bottom surface of the core layer, a plurality of through vias that vertically penetrate the core layer and electrically connect the upper wiring layer to the lower pads, and a dummy structure on a lower portion of the core layer. The dummy structure includes a dummy layer whose bottom surface is coplanar with the bottom surface of the core layer, a barrier layer between the core layer and the dummy layer, and a dielectric layer between the core layer and the barrier layer. The dummy structure is horizontally spaced apart and electrically insulated from the through vias.